Product
Product
WH-DP50 semiconductor laser marking machine
Basic information
商品名稱： WH-DP50 半導(dǎo)體激光打標(biāo)機(jī)
商品編號： WH-DP50 半導(dǎo)體激光打標(biāo)機(jī)
上架時間： 2015-05-21
適用材料： 普通金屬及合金(鐵、銅、鋁、鎂、鋅等所有金屬)，稀有金屬及合金(金、銀、鈦)，金屬氧化物，特殊表面處理(磷化、鋁陽極化、電鍍表面)，ABS料(電器用品外殼，日用品)，油墨(透光按鍵、印刷制品)，環(huán)氧樹
適用行業(yè)： 應(yīng)用于電子元器件、五金制品、工具配件、集成電路(IC)、電工電器、手機(jī)通訊、精密器械、眼鏡鐘表、首飾飾品、汽車配件、塑膠按鍵、建材、PVC管材、醫(yī)療器械等行業(yè)。
Product details
Trade name: WH-DP50 semiconductor laser marking machine
Product No.: WH-DP50 semiconductor laser marking machine
On sale time: 2015-05-21
Applicable materials: common metals and alloys (all metal including iron, copper, aluminium, magnesium, zinc, and etc.), rara metals and alloys (gold, silver, titanium), metallic oxides, ABS materials, inks, epoxy resins, and etc.
Application: electronic components, hardware products, tools, integrated circuits (IC), precision machineries, auto parts, building materials, PVC pipes, and etc.
Optical design:
Laser cavity adopts novel design philosophy.
Machine design:
Adopting integrated design, novel light path sealing mode.
Parameters:
|
Model Model name
|
WH-DP 50/75 |
|
Max. average power |
50W/75W |
|
Wavelength |
1064nm |
|
Beam quality |
＜3(25A) |
|
Pulse Frequency |
≤60KHz |
|
Marking area |
50mmX50mm/100mmX100mm/175mmX175mm |
|
Marking Speed |
Linear scan 7000mm/s |
|
Min. line width |
50um |
|
Min. character size |
0.3mm |
|
Repeat Accuracy |
±0.003mm |
|
M Power Consumption |
＜2.0KW |
|
Marking Graph |
User-defined character , CAD data |
|
Supported Format |
BMP,JPG,PNG,TIF,PCX,TAG,IOO,GIF,PLT |
|
Operation Humidity |
45%-75% |
|
Working Temperature |
10℃-30℃ |
|
Dimension |
1250mmx1220mmx1350mm |
|
Weight |
200kg/230kg |
Samples:
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